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Automatic laser wafer marking Equipment  

Automatic laser wafer marking Equipment

  • category:Automatic wafer laser marking equipment
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  • Release date:2020-07-30 14:23:47
  • Product Overview
  • Processing advantages
  • Technical Parameters
  • Samples show

Product name: Automatic laser wafer marking Equipment

Application field: this type of equipment can be applied to all kinds of Wafer , including Si, Si+Adhesive, Si+glass.


Processing advantages:

This type of equipment could be used for the front the back marking,fast marking speed, high efficiency, small focused spot, can achieve ultra-fine marking, less marking dust,without washing, the equipment can be adapted to 6 inches, 8 inches 12 inches wafer.



Technical Parameters

Laser wavelength

532nm 355nm

Output power

15W 10W

Beam quality

<1.3

Laser safety Class

Class IV

Scanning Area

290*290mm

Marking speed

500 characters/s

Precision

±0.05mm

Platform Repetition Accuracy

±0.0025mm

cooling Mode

Water cooling

Operating Temperature Environment

22 ±2 ℃

power consumption

<4.5~6.0kw

Dimensions

1.8m*1.7m*1.9m



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    Inquiry

    181-2621-4961

    Shenzhen Inte Laser Technology CO.,Ltd.

    Tel:0755-27840048

    Email:info@intelaser.com.cn

    Add:Add:2F,B Building,jingang Technology Park, Fuyong Street Bridge ommunity,Bao’an District, Shenzhen, China.

    Add:Huifeng seven Road No. 2, Zhong Kai Hi-tech Zone, Huizhou City.


    Copyright © en.intelaser.com.cn Shenzhen Inte Laser Technology CO.,LTD Specializing in Glass cutting machine, FPC laser cutting machine, laser cutting equipment,Welcome to inquire!
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