Product name: Automatic laser wafer marking Equipment
Application field: this type of equipment can be applied to all kinds of Wafer , including Si, Si+Adhesive, Si+glass.

Processing advantages:
This type of equipment could be used for the front the back marking,fast marking speed, high efficiency, small focused spot, can achieve ultra-fine marking, less marking dust,without washing, the equipment can be adapted to 6 inches, 8 inches 12 inches wafer.
Technical Parameters |
|
Laser wavelength |
532nm 355nm |
Output power |
15W 10W |
Beam quality |
<1.3 |
Laser safety Class |
Class IV |
Scanning Area |
290*290mm |
Marking speed |
500 characters/s |
Precision |
±0.05mm |
Platform Repetition Accuracy |
±0.0025mm |
cooling Mode |
Water cooling |
Operating Temperature Environment |
22 ±2 ℃ |
power consumption |
<4.5~6.0kw |
Dimensions |
1.8m*1.7m*1.9m |


181-2621-4961
Tel:0755-27840048
Email:info@intelaser.com.cn
Add:Add:2F,B Building,jingang Technology Park, Fuyong Street Bridge ommunity,Bao’an District, Shenzhen, China.
Add:Huifeng seven Road No. 2, Zhong Kai Hi-tech Zone, Huizhou City.