Product name:Single/dual platform picosecond UV cutting equipment(manipulator)
Product introduction:Stable equipment performance, low power consumption, wide range of cutting adaptation products: compact structure, easy to understand software operation, good man-machine interface, equipment with correction system; high precision CCD vision system, high cutting accuracy, Stable performance low maintenance cost; application areas: FPC, camera module, fingerprint module, etc. can be cut.

Processing advantages:
a.It can realize FPC shape, soft hard board opening, PCB sub-board, camera module cutting, to meet the rapid cutting of different thickness different materials;
b. The self-developed softwarecan realize functions such as automatic feeding, automatic cutting, automatic counting, unloading;
c. It can achieve high-quality, high-efficiency processing, cutting without carbonation processing effect;
d.The sealed optical path is stable reliable, the built-in automatic power measurement optimization system can ensure stable power during processing;
e.The software can set any target point, automatically analyze the material expansion contraction to adjust the cutting graphics to achieve high-precision cutting.
Technical Parameters |
|
Laser wavelength power |
UV355/15W/30W |
Beam quality |
<1.1 |
Laser safetyClass |
Class IV |
Scanning Area |
500mm*500mm |
Galvanometer scanning speed |
1000-3000mm/s |
Cuttingspeed |
±0.03mm |
PlatformRepetition accuracy |
±0.003mm |
coolingMode |
Water cooling |
Operating Temperature Environment |
22±2℃ |
Humidity requirements |
30-60%no condensation |
power consumption |
<4.0kw |
Dimensions |
1.8m*1.5m*1.9m |


181-2621-4961
Tel:0755-27840048
Email:info@intelaser.com.cn
Add:Add:2F,B Building,jingang Technology Park, Fuyong Street Bridge ommunity,Bao’an District, Shenzhen, China.
Add:Huifeng seven Road No. 2, Zhong Kai Hi-tech Zone, Huizhou City.